Intel is developing SDR/DDR SDRAM chipsets for future Intel processors. They are not abandoning RDRAM but they are branching out into supporting DDR memory due to industry demand. We expect the chipsets, codenamed Almador and Brookdale, should support DDR SDRAM and should start arriving in Q3 2001, well after the i850 chipset launches for the Pentium 4 in Q4 2000 with dual-RDRAM channels. The i850 chipset, and its RDRAM replacement Tehama-E (i850 MCH + ICH3 = Tehama-E), are to remain the choices for top performance while the SDR/DDR chipsets move into the mainstream for both the Pentium 4 and Pentium III.

Intel will be moving their high-end processors to a .13 micron process. As usual, using a smaller process provides many advantages. First, it saves money by allowing more processors to be built with one silicon wafer. Second, it saves power and reduces heat by decreasing the power needed per gate per clock. And third, it allows higher clock speeds because smaller gates can switch faster.

The disadvantage of a smaller process is that it increased the heat density of the processor. When more gates are squeezed into less space and the clock speed is turned up, a tremendous amount of heat is produced across a tiny surface area. Because of the increased heat density of .13 micron, Intel will be doing two things.

First, they will integrate a heat spreader into the processor package. This heat spreader will provide a wider contact patch for whatever heat sink is used. This lessens the danger of CPU failure due to an improperly installed or designed heat sink.

Second, they are calling for more advanced heat sink designs. At IDF, Intel was showing a copper-based heat sink with aluminum fins, weighing in at a hefty 450g. This massive heat sink is the reason for the redesigned case for the Pentium 4 mentioned above. As clock speeds increase, transistor count rises, and die sizes shrink, you can expect more exotic cooling methods in the future.

On a side note, AMD will be moving to a .15 micron process with their processors. It will be interesting to see how the difference in process technology will affect each competitor's clock speed and performance.